Electroless Copper Plating Solution

Electroless Copper Plating Solution
Details:
Stable Dispersion: The solution remains homogeneous for extended periods and resists degradation or stratification.
Controlled Deposition Rate: Ensures smooth, dense, and uniform copper layers, minimizing defects such as pinholes or peeling.
Low Consumption & Cost-Effective: Efficient usage reduces overall operational costs.
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Description
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Our electroless copper plating solution is a mature, non-electrolytic copper plating reagent that relies on autocatalytic redox reactions to deposit a copper layer without the need for an external power source. The formulation is carefully balanced, offering excellent system stability. Deposited copper layers exhibit strong adhesion and uniform coverage, making the solution compatible with conventional copper plating production lines and suitable for metallization of various substrate surfaces.

 

Key Features

 

  • Stable Dispersion: The solution remains homogeneous for extended periods and resists degradation or stratification.
  • Controlled Deposition Rate: Ensures smooth, dense, and uniform copper layers, minimizing defects such as pinholes or peeling.
  • Low Consumption & Cost-Effective: Efficient usage reduces overall operational costs.
  • Strong Adhesion: Copper layer firmly adheres to different substrates for reliable metallization.

 

Parameter Item

Details

Packaging Specification

25L per drum

Main Ingredients & Parameters

1. Copper Sulfate: 2%, CAS: 7758-99-7

2. Sodium Hypophosphite: 3%, CAS: 7681-53-0

3. Sodium Citrate: 1.5%, CAS: 68-04-2

4. Boric Acid: 1.5%, CAS: 10043-35-3

5. Sodium Hydroxide: 0.5%, CAS: 1310-73-2

6. Water: 91.5%, CAS: 7732-18-5

Shelf Life

12 months

Product Application

It forms copper coating by autocatalytic redox reaction without external power supply. Widely used for PCB circuit boards, electronic components, plastic surface metallization, artworks and decorative products.

Storage Instructions

Store in plastic drums only. Metal containers such as iron, copper and zinc are prohibited. Keep tightly sealed, store in cool and dark place, away from heat sources and open flames. Ensure good ventilation and anti-leakage treatment in the warehouse.

 

Application Areas

 

The electroless copper plating solution is primarily used in PCB manufacturing and processing of various electronic components. It is also widely applied in metallization of plastic products, craft and decorative items, and other copper plating applications.

 

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Quality Assurance & Service

Our company maintains a comprehensive quality control system, with each batch subjected to specialized testing to ensure consistent quality. Products come with a one-year warranty, and our after-sales team provides guidance for proper process usage.

 

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