Gold stripping agent is an industrial chemical specifically designed to remove electroplated or chemically deposited gold layers from metal surfaces. Its core function is to achieve a cyanide-free stripping process. Based on a cyanide-free formula, this product meets EU export standards and selectively dissolves the gold plating layer through a specific chemical reaction, while avoiding corrosion of the substrate material.
The gold stripping agent is prepared using organic acids, alkaline compounds, organic salt buffers, surfactants, alcohols, chlorides, and other components. Using a wafer as the anode and a titanium mesh as the cathode, the wafer is immersed in the stripping agent, and electrochemical stripping of elemental gold is performed under a constant current. By controlling the composition, content, pH stability, and process parameters, the gold stripping rate can be controlled, surface roughness can be uniformly improved, and the adhesion of the next film layer can be enhanced, without color difference, thus achieving an environmentally friendly stripping effect.
